WebSO是指一款封裝的集合, 其中包含了 SSOP、TSSOP 、TSOP 等封裝。. SO 是釘架為金屬材質SO 與對應的DIP封裝有相同的釘腳。. 它比同等的DIP封裝減少約30~50%的空間, 厚度方面減少約70%。. SSOP是兩側有腳且腳距為1.0mm以下之產品稱為 Shrink Small Outline Package。. TSSOP其膠體寬度 ... WebDownload package data for CAD tool, such as 3D model data in STEP format and reference land pattern data designed following JEITA ET-7501 Level3.
TSSOP28封装(含TSSOP16)_tssop28-硬件开发工具类资源 …
Web全新原装正品TPA3112D1PWPR TPA3112D1贴片TSSOP28音频功率放大器. 深圳明嘉瑞科技有限公司 6 年. 月均发货速度: 暂无记录. 广东 深圳市. ¥ 2.80. WebTSSOP-28 Datasheet TSSOP-28 - Fairchild Semiconductor 16-BIT CCD/CIS ANALOG SIGNAL PROCESSOR, Unisonic Technologies TSSOP-28-EP the pigs gastrobar
TSSOP-8 封装尺寸图 - 百度文库
WebMar 28, 2024 · 1.简要信息如下: 2. SOP和SOIC的规格多是类似的,现在大多数厂商基本都采用的是SOIC的描述: SOIC8有窄体150mil的(外形封装宽度,不含管脚,下同), 管脚间距 … WebFeb 24, 2013 · The Thin Shrink Small Outline Package, or TSSOP, is a rectangular surface mount plastic package with gull-wing leads. It has a smaller body and smaller lead pitch than the standard SOIC package. It is also smaller and thinner than a TSOP with the same lead count. The TSSOP come in body sizes of 3.0mm, 4.4mm and 6.1mm. WebTSSOP28, plastic, thin shrink small outline package; 28 terminals; 0.65 mm pitch; 4.4 mm x 9.7 mm x 0.95 mm body 7 January 2024 Package information 1 Package summary Terminal position code D (double) Package type descriptive code TSSOP28 Package style descriptive code TSSOP (thin shrink small outline package) Package body material type P (plastic) sid and sod